RFIC Industry Paper Awards
| Author(s), Affiliation | Paper Title | |
| 2022 | ||
| 1st | Renzhi Liu, Asma Beevi K. T., Richard Dorrance, Timothy Cox, Rinkle Jain, Tolga Acikalin, Zhen Zhou, Tae Young Yang, Johanny Escobar Pelaez, Shuhei Yamada, Kenneth Foust, Brent Carlton Intel Corporation |
A 2Gb-s 9.9pJ-b Sub-10GHz Wireless Transceiver for Reconfigurable Full-duplex Wireless Networks and Short-Range Multicast Applications |
| 2nd | Siraj Akhtar, Gerd Schuppener, Tolga Dinc, Baher Haroun, Swaminathan Sankaran Texas Instruments |
DC to 12+GHz, +30dBm OIP3, 7.2dB Noise Figure Active Balun in 130nm BiCMOS for RF Sampling Multi-Gbps Data Converters |
| 3rd | Shahriar Shahramian, Michael Holyoak, Mike Zierdt, Joe Weiner, Amit Singh, Yves Baeyens Nokia Bell Labs |
An All-Silicon E-Band Backhaul-on-Glass Frequency Division Duplex Module with >24dBm PSAT & 8dB NF |
| 2021 | ||
| 1st | Guillaume Tochou, Robin Benarrouch, David Gaidioz, Andreia Cathelin, Antoine Frappé, Andreas Kaiser, Jan Rabaey ST Microelectronics |
A Fully-Digital 0.1-to-27Mb/s ULV 450MHz Transmitter with Sub-100μW Power Consumption for Body-Coupled Communication in 28nm FD-SOI CMOS |
| 2nd | Tolga Dinc, Siraj Akhtar, Sachin Kalia, Baher Haroun, Swaminathan Sankaran Texas Instruments |
Doubly-Tuned Transformer-Based Class-E Power Amplifiers in 130nm BiCMOS for mmWave Radar Sensors |
| 3rd | Saeid Daneshgar, Hao Li, Taehwan Kim, Ganesh Balamurugan Intel Corporation |
A 128Gb/s PAM4 Linear TIA with 12.6pA/√Hz Noise Density in 22nm FinFET CMOS |
| 2020 | ||
| 1st | Amit Singh, Mustafa Sayginer, Michael J. Holyoak, Joseph Weiner, John Kimionis, Mohamed Elkhouly, Yves Baeyens, Shahriar Shahramian Nokia Bell Labs |
A D-Band Radio-on-Glass Module for Spectrally-Efficient and Low-Cost Wireless Backhaul |
| 2nd | Ayssar Serhan, Damien Parat, Pascal Reynier, Manuel Pezzin, Renaud Mourot, Fabrice Chaix, Rana Berro, Paramartha Indirayanti, Carl De Ranter, Kefeng Han, Marc Borremans, Eric Mercier, Alexandre Giry CEA-LETI |
A Reconfigurable SOI CMOS Doherty Power Amplifier Module for Broadband LTE High-Power User Equipment Applications |
| 3rd | Sang Gyun Kim, In Chang Ko, Seung Hwan Jung GRIT Custom-IC |
High Resolution CMOS IR-UWB Radar for Non-Contact Human Vital Signs Detection |
| 2019 | ||
| 1st | Renzhi Liu, Asma Beevi K. T., Richard Dorrance, Deepak Dasalukunte, Mario A Santana Lopez, Vinod Kristem, Shahrnaz Azizi, Minyoung Park, and Brent Carlton Intel Corporation |
An 802.11ba-Based, -92.6dBm-Sensitivity, Blocker Tolerant 495µW Wake-up Radio Fully Integrated with Wi-Fi Transceiver |
| 2nd | Wooram Lee, Tolga Dinc, and Alberto Valdes-Garcia IBM T.J. Watson Research Center |
Reconfigurable mmWave Radar Transmitter SoC with Broadband Frequency Tripler in 45nm SOI CMOS |
| 3rd | Steven Turner, Mark Stuenkel, Gary Madison, Justin Cartwright, Richard Harwood, Joseph Cali, Steve Chadwick, Michael Oh, John Matta, James Meredith, Justin Byrd, and Lawrence Kushner BAE Systems |
Direct Digital Synthesizer with 14 GS/s Sampling Rate Heterogeneously Integrated in InP HBT and GaN HEMT on CMOS |
| 2018 | ||
| 1st | Erik Öjefors, Mikael Andreasson, Torgil Kjellberg, Håkan Berg, Lars Aspemyr, Richard Nilsson, Klas Brink, Robin Dahlbäck, Dapeng Wu, Kristoffer Sjögren, and Mats Carlsson Silvers IMA AB |
A 57-71 GHz Beamforming SiGe Transceiver for 802.11ad-Based Fixed Wireless Access |
| 2nd | Timothy LaRocca, Khanh Thai, Rob Snyder, Richard Jai, Owen Fordham, Yeat Yang, Monte Watanabe, and Bryan Wu Northrop Grumman Aerospace Systems |
Q-Band CMOS Transmitter System-on-Chip for Protected Satellite Communication |
| 3rd | Chia-Hsin Wu, Chris W. Hunter, Jongdae Bae, Huijung Kim, Jisoo Chang, Jacob Sharpe, Inhyo Ryu, Seongwon Joo, Byeongwan Ha, Won Ko, Jounghyun Yim, Sangwook Han, Taewan Kim, Daeyoung Yoon, Inyoung Choi, Sangyun Lee, Qing Liu, Myounggyun Kim, Jiyoung Lee, Shinwoong Kim, Michael J. Cowell, and Thomas Byunghak Cho Samsung Electronics Co., Ltd. |
A 28nm CMOS Wireless Connectivity Combo IC with a Reconfigurable 2x2 MIMO WiFi supporting 80+80MHz 256-QAM, and BT 5.0 |
| 2017 | ||
| 1st | Hong-Teuk Kim, Byoung-Sun Park, Seung-Min Oh, Seong-Sik Song, Jong-Moon Kim, So-Hyeong Kim, Tak-Su Moon, Seung-Yeon Kim, Ji-Young Jang, Sung-Woong Kim, Woo-Seong Kang, Seung-Yoon Jung, Geum-Young Tak, and Yo-Chuol Ho LG Electronics, Inc. |
A 28GHz CMOS Direct Conversion Transceiver with Packaged Antenna Arrays for 5G Cellular Systems |
| 2016 | ||
| 1st | Jan van Sinderen and Bernard Burdiek NXP Semiconductors |
A Wideband Single-PLL RF Receiver for Simultaneous Multi-band and Multi-channel Digital Car Radio Reception |
| 2015 | ||
| 1st | S. Shahramian, M.J. Holyoak, Y. Baeyens Bell Laboratories, Alcatel-Lucent |
A 16-Element W-Band Phased Array Transceiver Chipset with Flip-Chip PCB Integrated Antennas for Multi-Gigabit Data Links |