3D Integration of ICs and Antennas for Ubiquitous mm-Wave Arrays

Translating large-scale mm-wave arrays to mass-market commercial SATCOM and 5G applications presents exciting challenges and opportunities. Innovation in mm-wave ICs across heterogeneous technologies must be combined with packaging approaches that consider RF, thermal, and mechanical performance while satisfying commercial cost constraints. This talk will present our work on the co-integration of mm-wave antennas and ICs for scalable arrays, demonstrating commercial solutions at 5G. We will also discuss emerging architectures that leverage heterogeneous ICs to further improve array performance and power consumption.